PHOIBOS aims at both novel concepts for photonic system integration by enabling multi-chip assemblies of a wide variety of pre-processed dies, and at the associated fabrication processes and machinery. In particular, PHOIBOS’ technical and scientific objectives are:
Objectives
Photonik Forschung Deutschland Förderinitiative „Integrierte Mikrophotonik“
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Setting up a multi chip module with photonic wire bonds
- Exploration and development of novel concepts that enable automated industrial production of photonic multi-chip modules
- Exploration, development and proof-of-principle demonstration of fabrication machinery and lithography processes that open the possibility of industrial mass production
- Exploration, development, and realization of multi-chip modules that rely on photonic wire bonds
- Experimental demonstration of the viability of photonic multi-chip modules in optical communication
